Used bonder

2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

• Manufacturer: TDK - Lambda

Includes: FINEPLACER lambda Bonding force module FD3 Chip heating module Optional Dispensing Module FG3 WinFlipChip software version 3.2 Revision 052 and PC Option: Substrate heater 50mm x 50mm or 50mm x 10...