Semiconductors » Wafer Bonders

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Used Wafer Bonders

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Overview

Wafer bonders are precision semiconductor tools that join two wafers using thermal, anodic, adhesive, or hybrid bonding methods. They handle sub-micron alignment, temperature control, force and vacuum to produce reliable bonds used in 3D IC stacking, MEMS, sensors and imaging devices. These systems require cleanroom installation, careful process recipes and regular calibration to maintain high yield and throughput in production or R&D environments.

FAQ

What should I inspect when buying a used wafer bonder?

Check alignment accuracy, heater and chuck condition, vacuum integrity, control software version, maintenance logs, available recipes, and spare parts availability. Verify wafer handling fixtures and sensors for wear.

How do I confirm compatibility with my wafers and process?

Confirm supported wafer sizes (e.g., 200/300 mm), bonding methods (thermal/anodic/adhesive/hybrid), maximum temperature and force, cycle time, and whether recipes can be exported/imported to match your process.

What are shipping requirements for a wafer bonder?

Use a carrier experienced with semiconductor tools. Clean and purge the system, secure fragile optics and chucks, use climate-controlled transport if required, and insure the shipment. Prepare documentation for customs and hazardous materials if applicable.

What utilities and site prep are needed for installation?

Typical needs include classed cleanroom space, stable electrical power, chilled water or chillers, DI water, dry nitrogen, compressed air, proper exhaust, and adequate floor loading. Arrange OEM or specialist installation support.

What maintenance and calibration should I plan for?

Schedule regular checks of vacuum pumps, seals, heaters, alignment sensors, and motion stages. Replace O-rings and filters per hours or cycles, perform temperature and alignment calibrations periodically, and keep firmware and recipes backed up.