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Used processing

  • Electronic Visions Group (EVG) EV420

    Electronic Visions Group (EVG) EV420 Wafer Bond Aligner

    • Manufacturer: EVG

    EV420 Wafer Bond Aligner 6" (150mm) wafer diameter capability Joystick alignment only No exposure optics - tool cannot be used for lithography processing

    $11,000 USD

    Get financing

    Est. $216/mo

    New York, USA
  • Electronic Visions Group (EVG) EV620

    Electronic Visions Group (EVG) EV620 Wafer Bond Aligner

    • Manufacturer: EVG
    • Model: EV620

    EV620 Mask aligner used for wafer bonding alignment 6" (150mm) wafer diameter capable No exposure optics - cannot be used for lithography processing Joystick and manual dials for alignment

    $11,000 USD

    Get financing

    Est. $216/mo

    New York, USA
  • Logitech 1WBS2 wafer bonder for

    Logitech 1WBS2 wafer bonder for wafers up to 100mm

    • Manufacturer: Logitech

    Logitech 1WBS2 wafer bonder set up for 100mm wafers digital process display vacuum and positive pressure bonding programmable bonding temperature water cooling loop 110v

    $16,500 USD

    Get financing

    Est. $324/mo

    San Jose, CA
  • Trusted Seller
    EVG 520 Semi-Automatic Wafer bonders

    EVG 520 Semi-Automatic Wafer bonders x 2 sets Both 2010 Year of Manufacture

    • Manufacturer: EVG
    • Model: 520

    EVG 520 wafer bonders Currently installed and can be Tested with CSI Semi Engineer onsite. Serial No. SXXXX05 , (2010) Serial No. SXXXX78 , (2010) Semi-automated Wafer Bonders Configurable for all wafer bonding p...

    Bree, Ireland
  • Trusted Seller
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    Logitech WSB2

    • Manufacturer: Logitech

    Logitech WSB2 LOGITECH WAFER SUBSTRATE BONDING UNIT Wafer Substrate Bonding Unit Bonding techniques for the processing of thin and fragile II-VI and III-V semiconductor wafers such as silicon, GaAs and InP which ...

    Bree, Ireland
  • Trusted Seller
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    Automated Debonding System

    • Manufacturer: Unknown

    EVG850DB Automated Debonding System Wafer Processing System for Debonding, Cleaning and Unloading of Thin Wafers up to 200mm Tooled for debonding of 150 mm Device Wafers from 150 mm Carrier Wafer SECS II / GEM – ...

    Bree, Ireland
  • Trusted Seller
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    Semi Automated High Force Wafer Bonder

    • Manufacturer: Unknown

    Q 4029-2 SUSS CB200M SEMI AUTOMATED HIGH FORCE BONDER 06,1025561 SYSTEM 200M LOADER MODULE 1X 06,1024105 CB200 BASE MACHINE WITH HIGH FORCE OPTION 3kN to 90kN Process Bond Chamber TURBO PUMP KIT, CB200 PC for CB2...

    Bree, Ireland
  • Trusted Seller
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    Temporary Bonding System

    • Manufacturer: Unknown

    EVG850TB Automated Temporary Bonding System Wafer Processing System for Coating, Bake and Bonding of Wafers up to 200mm Tooled for bonding of 150 mm Device Wafers to 150 mm Carrier Wafer Wafermapping in Cassette ...

    Bree, Ireland
  • 2011 Wafer Bonding SUSS MicroTec

    2011 Wafer Bonding SUSS MicroTec SB8E Substrate Bonder

    • Manufacturer: SÜSS MicroTec
    • Model: SB8E

    Specifications: SB8e -Offering flexibility and accuracy for production and/or laboratory wafer bonding of two or more wafers. All known wafer bond processes supported with user friendly software allowing unlimi...

    Wu Xi Shi, China
  • Wafer Bonding machine

    Wafer Bonding machine

      1. Semi-automatic wafer bonding machine, which can effectively perform wafer bonding operations. Features 1. The whole process of wafer bonding is controlled by touch screen. The semi-automatic wafer bonding mach...

      Guangzhou, China

    Overview

    Wafer bonders are precision semiconductor tools that join two wafers using thermal, anodic, adhesive, or hybrid bonding methods. They handle sub-micron alignment, temperature control, force and vacuum to produce reliable bonds used in 3D IC stacking, MEMS, sensors and imaging devices. These systems require cleanroom installation, careful process recipes and regular calibration to maintain high yield and throughput in production or R&D environments.

    FAQ

    What should I inspect when buying a used wafer bonder?

    Check alignment accuracy, heater and chuck condition, vacuum integrity, control software version, maintenance logs, available recipes, and spare parts availability. Verify wafer handling fixtures and sensors for wear.

    How do I confirm compatibility with my wafers and process?

    Confirm supported wafer sizes (e.g., 200/300 mm), bonding methods (thermal/anodic/adhesive/hybrid), maximum temperature and force, cycle time, and whether recipes can be exported/imported to match your process.

    What are shipping requirements for a wafer bonder?

    Use a carrier experienced with semiconductor tools. Clean and purge the system, secure fragile optics and chucks, use climate-controlled transport if required, and insure the shipment. Prepare documentation for customs and hazardous materials if applicable.

    What utilities and site prep are needed for installation?

    Typical needs include classed cleanroom space, stable electrical power, chilled water or chillers, DI water, dry nitrogen, compressed air, proper exhaust, and adequate floor loading. Arrange OEM or specialist installation support.

    What maintenance and calibration should I plan for?

    Schedule regular checks of vacuum pumps, seals, heaters, alignment sensors, and motion stages. Replace O-rings and filters per hours or cycles, perform temperature and alignment calibrations periodically, and keep firmware and recipes backed up.