Semiconductors » Wafer Slicing / Dicing » Massachusetts

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Used Wafer Slicing / Dicing in Massachusetts, USA

  • Trusted Seller
    REBUILT MICROAUTOMATION 1100

    REBUILT MICROAUTOMATION 1100

    • Manufacturer: Micro Automation

    Completely Rebuilt 200mm dicing saw. This saw is capable of cutting 8″ wafers (200mm) on film frames. It is offered by JM Industries (25 years in the semiconductor industry) All new PLC controls, color touch scre...

    Billerica, MA
  • Trusted Seller
    TSK 2500

    TSK 2500

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK

    6″ WAFER DICING SAW WITH OPTICS AND HIGH POWER SPINDLE OUT OF STOCK

    Billerica, MA
  • Trusted Seller
    TEMPRESS 602

    TEMPRESS 602

    • Manufacturer: Tempress

    3″ AIR BEARING DICING SAW, INCLUDES MICROSCOPE

    Billerica, MA
  • Trusted Seller
    MICROAUTOMATION 1100

    MICROAUTOMATION 1100

    • Manufacturer: Micro Automation

    6″ MICROPROCESSOR CONTROLLED DICING SAW WITH CCTV AND VIDEO CAMERA.

    Billerica, MA
  • Trusted Seller
    LOOMIS SCRIBER LCD 2P

    LOOMIS SCRIBER LCD 2P

    • Manufacturer: Loomis

    LOOMIS SCRIBER LCD 2P ( TEMPRESS SCRIBER COMPLETELY REBUILT BY LOOMIS) INCLUDES WAFER BREAKER OPTION (SCRIBES AND BREAKS UP TO 4″ WAFERS)

    Billerica, MA
  • Trusted Seller
    Microautomation 2006

    Microautomation 2006

    • Manufacturer: Micro Automation

    MICROAUTOMATION 2006 SCRUBBER, UP TO 6″ WAFERS BRUSH CLEAN, MICROPROCESSOR CONTROLLED SERVICED AND TESTED BY FACTORY TRAINED TECHNICIAN

    Billerica, MA
  • Trusted Seller
    DYNATEX Z760

    DYNATEX Z760

    • Manufacturer: Dynatex

    WAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6″ PRIOR TO DICING, SCRIBING

    Billerica, MA
  • Trusted Seller
    Philtec 2015

    Philtec 2015

    • Manufacturer: Philtec

    PHILTEC WAFER GROOVER/SECTIONER

    Billerica, MA
  • Trusted Seller
    LOOMIS SCRIBER LCD 1

    LOOMIS SCRIBER LCD 1

    • Manufacturer: Loomis

    LOOMIS SCRIBER LCD 1 ( TEMPRESS SCRIBER COMPLETELY REBUILT BY LOOMIS) INCLUDES WAFER BREAKER OPTION (SCRIBES AND BREAKS UP TO 3″ WAFERS) 5″ RING FOR TAPE

    Billerica, MA
  • Trusted Seller
    Loomis LSD100 Scriber

    Loomis LSD100 Scriber

    • Manufacturer: Loomis

    *Roller-style breaker for up to 4″ wafers *Motorized rotation control *Color camera

    Billerica, MA
  • Trusted Seller
    Viking 1010B

    Viking 1010B

    • Manufacturer: Viking

    VIKING 1010B DIE EXPANDER

    Billerica, MA
  • Trusted Seller
    Tempress 2

    Tempress 2

    • Manufacturer: Tempress

    auto indexing, includes microscope

    Billerica, MA
  • Trusted Seller
    LOOMIS MKT 33

    LOOMIS MKT 33

    • Manufacturer: Loomis

    SEMIAUTOMATIC SCRIBER

    Billerica, MA
  • Trusted Seller
    K&S 382

    K&S 382

    • Manufacturer: Kulicke & Soffa

    K&S 382 AUTO FILM FRAME MOUNTER (BONDER) INCLUDES QTY 25 6″ FILM FRAMES

    Billerica, MA
  • Trusted Seller
    TEMPRESS 1713

    TEMPRESS 1713

    • Manufacturer: Tempress

    SEMIAUTOMATIC SCRIBER

    Billerica, MA
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    SÜSS MicroTec RA120M Wafer Slicing / Dicing

    • Manufacturer: SÜSS MicroTec
    • Model: RA120M

    Good condition SÜSS MicroTec RA120M Wafer Slicing / Dicings. Located in USA and other countries. Click request price for more information.

    USA
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Overview

Wafer dicing is the process of cutting semiconductor wafers into individual chips or die. This is a critical step in semiconductor manufacturing, where precision and cleanliness are paramount. The process typically involves the use of high-precision saws or lasers to ensure each chip is separated without damaging the delicate structures within.

FAQ

What should I consider when buying a wafer dicing machine?

Consider the precision of the machine, the type of cutting technology (saw or laser), the throughput, and compatibility with the wafer sizes you plan to process. Also, check for features that ensure minimal damage and high accuracy.

How do I ensure the wafer dicing machine is shipped safely to my location?

Use a reputable transport service with experience in handling sensitive and high-tech machinery. Ensure the machine is securely packed, ideally in its original packaging, and protected from vibrations and shocks during transit.

What is the maintenance schedule for a wafer dicing machine?

Regular maintenance includes cleaning the cutting area, checking and replacing blades or laser components, and ensuring all moving parts are lubricated. Follow the manufacturer's maintenance guidelines for detailed instructions and intervals.