Semiconductors » Wafer Grinding » Beijing

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Used processing in Beijing, China

  • TDL-600/1200

    TDL-600/1200

      This series of double-sided grinding machine is a high-precision, high-stability grinding and processing equipment, with the upper disc, lower disc, inner ring active drive, can be customized according to custome...

      Beijing, China
    • TSG-200A

      TSG-200A

        The machine is a double spindle, double table, through the diamond grinding wheel, the resin material will be processed by the creep-feed grinding method, with automatic thickness measurement, multi-stage grindin...

        Beijing, China
      • IVG-2040/3040

        IVG-2040/3040

          Fully automatic single-axis thinning machine is suitable for 4-12 inches wafer grinding, equipped with robot up and down, and integrated with automatic centering, cleaning and drying functions, equipped with auto...

          Beijing, China
        • TAP-500/600 Dual series

          TAP-500/600 Dual series

            This series of polishing machine is a high precision single-sided polishing equipment with double polishing discs, which can realize four-axis simultaneous processing, and the equipment can be configured accordin...

            Beijing, China
          • TFG-2200/3200 series

            TFG-2200/3200 series

              This equipment is a dual spindle three-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with automatic centerin...

              Beijing, China
            • TFG-3250

              TFG-3250

                This equipment is a 3-spindle, 4-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with auto-centering, transfer...

                Beijing, China
              • TSP-610/810/910/1270/1500 series

                TSP-610/810/910/1270/1500 series

                  This series of polishing machine is a ceramic disk as a carrier, through the paste wax or no wax adsorption way to fix the wafer for polishing of high-precision single-sided polishing equipment, dual-axis, four-a...

                  Beijing, China
                • IVG-2035/3035

                  IVG-2035/3035

                    Semi-automatic dual-axis thinning machine is suitable for 2-12 inches wafers and special specifications of the material grinding, manual loading mode, easy to operate, feature-rich, single-axis and dual-axis proc...

                    Beijing, China

                  Overview

                  Wafer grinding is a critical process in semiconductor manufacturing, primarily used to thin down silicon wafers to the desired thickness. The process ensures the wafers are uniformly thin and free of surface imperfections, which is crucial for the proper functioning of integrated circuits. This equipment is essential for achieving high precision and quality in wafer production.

                  FAQ

                  What factors should I consider when buying a wafer grinding machine?

                  Consider the machine's precision, grinding speed, and compatibility with different wafer sizes. Check for features like automatic thickness control and surface finish capabilities.

                  How do I safely ship a wafer grinding machine?

                  Use a specialized transport service for delicate machinery. Ensure the machine is securely packed with protective materials to prevent any damage during transit.

                  What maintenance does a wafer grinding machine require?

                  Regular maintenance includes checking and replacing grinding wheels, cleaning the machine, and ensuring all moving parts are well-lubricated. Follow the manufacturer's guidelines for detailed maintenance schedules.