New Wafer Slicing / Dicing

1019822-250 MPM BLADE 250mm

• Manufacturer: Yinuo

1019822-450 MPM BLADE 450mm

• Manufacturer: Yinuo

Cutter Cylinder KMC-M3T10-00

• Manufacturer: KMC

Panasonic CM402 N4520403-142 Vacuum Blade

• Manufacturer: Panasonic

Universal AI 46191204 RH CUTTER HOUSING ASSY

• Manufacturer: Yinuo

1017192-300 MPM BLADE 300mm

• Manufacturer: Yinuo

Universal AI 46191104 LH CUTTER HOUSING ASSY

• Manufacturer: Yinuo

1019822-350 MPM BLADE 350mm

• Manufacturer: Yinuo

HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment

• Manufacturer: Hgtech

Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...

Disco EAD6361

• Manufacturer: SEM

Semiconductor Equipment Manufacturing, Inc. is one of the largest supplier of Wafer Dicing Machine in Taiwan. Being specialized in our products for many years, our top ranking sales are due mostly in part to word...

Disco DFL 7161

• Manufacturer: SEM

Fully automatic laser saw for 300 mm wafers DFL7161, review the config as below.

6inch Dicing saw for semiconductor industry

• Manufacturer: Minder Hightech

Application: IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc. | Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.

Semi automatic wafer expander

• Manufacturer: Minder Hightech

Semi automatic film cutting and expanding machine chip packaging semi automatic crystal expanding machine 6 inch 8 inch 10 inch 12 inch film expanding equipment 1、 Introduction: Wafer expander is also called wafe...

MDHYDS12FA 12 inch discing saw for semiconductor industry

• Manufacturer: Minder Hightech

Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board