2011 Wafer Bonding SUSS MicroTec SB8E Substrate Bonder
used
- Manufacturer: SÜSS MicroTec
- Model: SB8E
Specifications: SB8e -Offering flexibility and accuracy for production and/or laboratory wafer bonding of two or more wafers. All known wafer bond processes supported with user friendly software allowing unlimi...
Wu Xi Shi, ChinaWafer Bonding machine
new
1. Semi-automatic wafer bonding machine, which can effectively perform wafer bonding operations. Features 1. The whole process of wafer bonding is controlled by touch screen. The semi-automatic wafer bonding mach...
Guangzhou, China