HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment
new
- Manufacturer: Hgtech
Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...
Wuhan, China
HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment
new
- Manufacturer: Hgtech
Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...
Wuhan, ChinaDisco EAD6361
new
- Manufacturer: Disco
Semiconductor Equipment Manufacturing, Inc. is one of the largest supplier of Wafer Dicing Machine in Taiwan. Being specialized in our products for many years, our top ranking sales are due mostly in part to word...
Hsinchu County, Taiwan
Disco DFL 7161
new
- Manufacturer: Disco
- Model: DFL7161
Fully automatic laser saw for 300 mm wafers DFL7161, review the config as below.
Hsinchu County, Taiwan
6inch Dicing saw for semiconductor industry
new
- Manufacturer: Minder Hightech
Application: IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc. | Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.
Guangzhou, China
Semi automatic wafer expander
new
- Manufacturer: Minder Hightech
Semi automatic film cutting and expanding machine chip packaging semi automatic crystal expanding machine 6 inch 8 inch 10 inch 12 inch film expanding equipment 1、 Introduction: Wafer expander is also called wafe...
Guangzhou, China
MDHYDS12FA 12 inch discing saw for semiconductor industry
new
- Manufacturer: Minder Hightech
Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board
Guangzhou, China
LGR-Series
new
- Manufacturer: TOWA JAPAN
Enables high-precision blade cutting of lead-less device products such as QFN packages. Selectable blade cut(FMS3040-HC) or laser cut(LGR1040) depending on process and lead frame design. Combining dedicated lead ...
Kyoto, Japan
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