Used Wafer Slicing / Dicing

Disco DAD3240

• used

• Manufacturer: Disco
• Model: DAD3240

Dicing saw

DISCO DFD6361

• used

• Manufacturer: Disco
• Model: DFD6361

Fully automatic dicing machine for 12-inch

Disco DFD6340

• used

• Manufacturer: Disco
• Model: DFD6340

Fully automatic dicing machine for 8-inch

Disco DFD6340

• used

• Manufacturer: Disco
• Model: DFD6340

Fully automatic dicing machine for 8-inch

Disco DFD651

• used

• Manufacturer: Disco
• Model: DFD651

Fully automatic dicing machine for 8-inch 2 spindles

Disco DFD6240

• used

• Manufacturer: Disco
• Model: DFD6240

Fully automatic dicing machine for 8-inch Single spindle Equipped with LCD touch panel and GUI

DISCO DFD6750

• used

• Manufacturer: Disco
• Model: DFD6750

Disco DFD6340

• used

• Manufacturer: Disco
• Model: DFD6340

DISCO DFD6750

• used

• Manufacturer: Disco
• Model: DFD6750

DISCO DFL 7161 Laser Saw

• used

• Manufacturer: Disco
• Model: DFL7161

- Wafer Size: 300 - Group: Electronic - Category: Semiconductor Assembly & Packaging - Family: Dicing Saws/Scribes - Type: Laser Dicing Saw

2013 DISCO DFL7360

• used

• Manufacturer: Disco
• Model: DFL7360

De-installed, Warehoused, Can be inspected Wafer size: 300MM

2010 DISCO DFD6361

• used

• Manufacturer: Disco
• Model: DFD6361

De-installed, Warehoused, Can be inspected Wafer size: 300MM

DISCO DAD3350

• used

• Manufacturer: Disco
• Model: DAD3350

Manufacturer: DISCO Model: DAD3350 Type of Machine : Wafer saw machine Condition : No malfunctions or missing parts Find more here - https://www.ucymachines.com/ Contact us at - sales@ucymachines.com

2007 ACCRETECH A-WD-300TX

• used

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300TX

De-installed, Warehoused, Can be inspected Wafer size: 300MM

2004 TSK A-WD-300T

• used

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300T

De-installed, Warehoused, Can be inspected Wafer size: 300MM